Temperature Range: Room Temperature - 1200C
Fusion Select Heating E-chips are comprised of a central ceramic heating membrane supported by a silicon substrate. Nine 8-micron holes are located in the center of the membrane to provide an electron transparent area for TEM imaging. These holes are arranged in a 3x3 array with 12 microns between holes. E-chips are available with three options for sample support over the holes: a carbon film with 2 micron holes (spaced 2 microns apart), a continuous silicon nitride film, or nothing over the holes for self-supporting samples.
The Fusion thermal E-chips are offered in two thermal calibration configurations: "vacuum only" for standard TEM experiments and "environmental" for experiments performed in an environmental TEM (E-TEM) or ex situ on the benchtop. The "vacuum only" configuration comes with the standard open loop calibration file whereas the "environmental" configuration comes with a specialized closed-loop calibration file made specifically for E-TEM or ex situ experiments. If you are not working in an E-TEM or on the benchtop, "vacuum only" thermal chips are recommended for your experiments.
A quantity of 1 of any part number indicates 1 box of E-chips. Each box contains 10 E-chips.
**Note: TEM imaging must occur through the holes due to the polycrystalline structure of the ceramic film.
E-chips are backwards compatible to last generation Fusion and legacy Aduro systems.
• Chip dimensions: 4 mm x 4.65 mm
• Chip thickness: 300 μm
• Support Film Thickness: SiN - approx. 40 nm | Holey Carbon - approx. 18 nm
• Viewing Hole Size: Nominally 8 µm diameter
• Viewing Hole Spacing: 12 µm
All feature dimensions listed should be considered nominal. Variations in dimensions can occur.