Temperature Range: Room Temperature - 900°C, Electrode Material: Tungsten
Fusion Electrothermal E-chips are Fusion Heating E-chips with four additional electrodes to support simultaneous heating and electrical characterization of samples. A thick layer of silicon nitride isolates the heating membrane from the electrodes. Samples are placed on the heating membrane, over a hole and spanning the electrodes, and electrical contacts can be formed via FIB metal deposition. Fusion Select systems can use the four center electrodes for a variety of electrical measurements including “4-point probe” characterization while heating. Older Fusion and Aduro systems can use the same chips, but only utilize the outer pairs of electrodes for measurements.
The Fusion Electrothermal E-chips are offered in two thermal calibration configurations: "vacuum only" for standard TEM experiments and "environmental" for experiments performed in an environmental TEM (E-TEM) or ex situ on the benchtop. The "vacuum only" configuration comes with the standard open loop calibration file whereas the "environmental" configuration comes with a specialized closed loop calibration file made specifically for E-TEM or ex situ experiments. If you are not working in an E-TEM or on the benchtop, "vacuum only" calibrated chips are recommended for your experiments.
A quantity of 1 of any part number indicates 1 box of E-chips. Each box contains 10 E-chips.
**Note: TEM imaging must occur through the holes due to the polycrystalline structure of the ceramic film.
E-chips are backwards compatible to last generation Fusion and legacy Aduro systems.
Key Measurements:
• Electrode Material: Tungsten
• Chip dimensions: 4 mm x 4.65 mm
• Chip thickness: 300 μm
• Sample support: ~50 nm thick silicon nitride
All feature dimensions listed should be considered nominal. Variations in dimensions can occur.