Fusion Select Electrical E-chips provide a platform for precise electrical biasing in current or voltage mode. The electrical stimuli are delivered to your sample via electrodes patterned directly on the E-chips. Typically platinum or tungsten deposition is used to create the electrical contact. EM imaging of samples is performed in the area around and between the electrodes.
FIB lamella can be deposited on any E-chip, but the FIB-optimized design is recommended for electrical-only experiments utilizing a lamella. The FIB-optimized E-chips offer a workflow that reduces preparation time in half as compared to other membrane-based electrical E-chips for FIB lamella preparation. A pass-through notch down the middle of the chip allows for easy sample deposition while eliminating the risk of shorting out the electrical connection. Additionally, the lack of a window membrane allows for the best possible resolution in the microscope, while eliminating membrane breakage risk. Use with the Protochips FIB stub and our step-by-step guides in the Success Community for streamlined FIB lamella deposition for in situ TEM research.
A quantity of 1 of any part number indicates 1 box of E-chips. Each box contains 10 E-chips.
**Note: there is a layer of photoresist on all Fusion electrical E-chips that must be removed before depositing samples. See the photoresist removal guide in the Protochips Success Community at success.protochips.com
E-chips are backwards compatible to last generation Fusion and legacy Aduro systems.
• Electrode Material: Platinum
• Chip dimensions: 4 mm x 3.05 mm
• Chip thickness: 300 μm
• Notch Width: nominally 10 µm
• Electrode Spacing: 20 µm across notch | 5 µm when on the same side of the notch (4-point only)
All feature dimensions listed should be considered nominal. Variations in dimensions can occur.