The Protochips FIB stub enables researchers to successfully deposit lamella onto any of Protochips E-chips to promote in situ studies of bulk materials and semiconductor devices. Our step-by-step guides on the Success Community walks researchers through every step of the deposition process, no matter their skill level.
Electrical characterization of semiconductor devices: The 90° slot at the top of the stub is used with the Fusion Select FIB-optimized E-chip for and follows the exact same workflow as attaching a lamella to a half grid. The E-chips sits perfectly flat in the slot and the lamella can easily be thinned from either side, allowing successful electrical characterization of semiconductor devices without shorting out the E-chip.
In situ TEM analysis of bulk materials: the 45° angled edges are used with any membrane-containing E-chips (heating, electrothermal, gas cell, liquid cell) to allow for deposition of the lamella without E-chip damage. Follow our step-by-step guide to learn the best angles within the FIB and how to thin the lamella once placed on the E-chip.